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ANCU®

COPPER ANODES FOR ELECTROPLATING - CLIPPINGS (SLUGS), BALL ANODES, FLAT COPPER ANODES AND PROFILE ANODES


Through a close working relationship with the users and manufacturers of electroplating plants, KME has gained the technical understanding and competence needed to supply the best possible grade of anode for any particular type of copper plating bath, whether acid or alkaline.

Advantages

  • Very homogeneous fine grain structure (hot worked extruded condition)
  • Very homogeneous with regard to the phosphorus dispersion, without segregations214
  • Uniform solution in the electrolyte
  • No risk of sludge
  • Uniform and very good copper plating


Materials
The basic material used for ANCU®- copper anodes by KME is always high purity electrolytically refined cathode copper having a purity of more than 99,98 %. Maximum impurities are given in the table alongside.

Maximum values
S0.0015 %
Ag0.0020 %
Ni0.0020 %
Fe0.0030 %
Pb0.0010 %
Sn0.0010 %
As0.0005 %
Sb0.0005 %
Se0.0005 %
Te0.0005 %
Bi0.0005 %

Homogeneity
ANCU®- anodes are of excellent homogeneity, with grain sizes of approx. 0.1 - 0.5mm. Its fine grain structure ensures very even dissolution in the plating bath and thus a sound, uniformly dense cathode deposit.

Quality
KME's ANCU®68 quality has been developed as a special grade for use in acid copper sulphate baths. The material develops a typical adherent dark brown film during electrolysis, acting as a diaphragm and thus preventing the formation of sludge. The film is achieved by the addition of phosphorus, which is but one of the additives used.

Selection of the correct grade of anode depends on the precise specification (material specification, samples) to be worked out beforehand between KME and the user. Upon request KME will supply inspection certificates acc. to EN 10204 for the various ANCU®-qualities.

  • View ANCU® grades and forms (pdf)